iPA integrates power, thermal & mechanical solutions into a single µP module
Author: Jim Kaskade
INCEP focuses on power, thermal, and EMI for high-performance microprocessors
PowerDirect™ provides a new distribution architecture with an advanced power interconnect
INCEP focuses on thermal, power, and EMI for high-performance microprocessors.
Computer industry pioneers Jack E. Shemer, Arthur J. Collmeyer, and Robert V. Adams have been