INCEP Introduces PowerDirect™ for High-Performance Semiconductors

PowerDirect™ provides a new distribution architecture with an advanced power interconnect

INCEP Technologies today announced the introduction of PowerDirect™, an innovative, low cost coaxial power interconnect for delivering high-currents as close to the integrated circuit as possible. This new power distribution architecture provides an extremely low inductance and resistance path from the power source to its destination. The PowerDirect’s current carrying capacity is 50 Amps, providing supporting transients (slew rates) as high as 400 Amps/us with a minimal required board area of only 0.11 in2.

PowerDirect™ technology combines a high-performance coaxial interconnect with an optimal printed-circuit board layout pattern, to provide a cost-effective solution for power delivery directly to high-performance semiconductor devices. The benefits associated with the PowerDirect™ include very low PCB surface and interplane area and improved PCB routability. Depending on the application, several PowerDirect™ components can be used to deliver electrical power from one substrate to another (intra-chip, chip-to-board, or board-to-board) resulting in the highest current per area compared to other traditional power delivery architectures.

There are several interconnect methods for the PowerDirect™ including plated-through-hole (PTH), screw, and surface mount technology (SMT). The various interfaces for the PowerDirect™ Coaxial Interconnect offer several assembly options and performance for PCB and chip designs.

Jim Kaskade

Jim Kaskade is a serial entrepreneur & enterprise software executive of over 35 years. He recently successfully exited a PE-backed SaaS company, Janrain, in the digital identity security space. He started his career engineering massively parallel processing datacenter applications. Prior to identity, he led a digital application business of over 7,000 people ($1B). Prior to that he led a big data & analytics business of over 1,000 ($250M). He was the CEO of a Big Data Cloud company ($50M); was an EIR at PARC (the Bell Labs of Silicon Valley) which resulted in a spinout of an AML AI company; led two separate private cloud software startups; founded of one of the most advanced digital video SaaS companies delivering online and wireless solutions to over 10,000 enterprises; and was involved with three semiconductor startups (two of which he founded, one of which he sold). Jim has an Electrical and Computer Science Engineering degree from University of California, Santa Barbara, with an emphasis in semiconductor design and computer science; and an MBA from the University of San Diego with an emphasis in entrepreneurship and finance.

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