iPA integrates power, thermal & mechanical solutions into a single µP module
INCEP focuses on power, thermal, and EMI for high-performance microprocessors
INCEP will present “System Interconnection & Power Delivery” during the session “Concept Technologies for High
INCEP Technologies promotes Jim Hjerpe Kaskade to President
PowerDirect™ provides a new distribution architecture with an advanced power interconnect
INCEP focuses on thermal, power, and EMI for high-performance microprocessors.
Computer industry pioneers Jack E. Shemer, Arthur J. Collmeyer, and Robert V. Adams have been
INCEP focuses on addressing thermal, power, and EMI issues for high-performance microprocessors