INCEP™ Announces License Agreement with Tyco Electronics for PowerDirect™ Connector Technologies
Tyco Electronics to offer products based on INCEP’s PowerDirect approach for the escalating power delivery challenges of high performance microelectronic devices and assemblies
San Diego, Calif., May 7, 2002 — INCEP Technologies, Inc. today announces the signing of a technology license agreement with Tyco Electronics Corporation for INCEP’s proprietary PowerDirect™ power interconnect. This agreement permits Tyco Electronics, a leading electrical/electronic connector products manufacturer, to design, manufacture, and market PowerDirect products for all segments of the computer and communication industries.
“The PowerDirect products developed and marketed under this agreement are valuable additions to Tyco Electronics’ power interconnect product lines. This product will meet next generation customer requirements for high speed, low voltage power delivery”, stated Greg Sites, Director of Product Management for the Communications, Computer, and Consumer Business Unit of Tyco Electronics. “The escalating power demands of high performance semiconductors are now pushing the limit on technologies which support getting energy to the device”, said Jim Hjerpe Kaskade, President and CEO of INCEP Technologies. “The PowerDirect products address the strong need for power interconnect alternatives for the microprocessor arena, and the agreement provides the path to meeting this growing demand for innovative power distribution”, he continued.
The PowerDirect connector is optimized for delivery of power for high transient current and low voltage applications. PowerDirect should meet the demands of today’s high performance microprocessors and other complex microelectronic devices and assemblies including CPU chip-sets, high-speed switches, and high-performance ASICs or FPGAs. The PowerDirect products will be focused on the connection between a printed circuit board and either another printed circuit board or flex circuit. PowerDirect products are planned for first availability starting in the fourth quarter of 2002.