INCEP Technologies™ Introduces iPA™ for Servers Based on Next Generation of Intel® Itanium™ Processors

iPA integrates power, thermal & mechanical solutions into a single µP module

INCEP Technologies today introduced iPA for high density servers based on the next-generation Intel® Itanium™ processor (code name McKinley). iPA is a single integrated proprietary power, thermal and mechanical module for server OEMs to integrate with McKinley. iPA is estimated to create volume savings of up to 40%, improve power margins by 50%, and provide over 40% gains in thermal efficiency. In addition, iPA will enable OEMs to package processors for 1U-2 way, 3U-4 way, 5U-8 way and emerging “Blade” servers. Shipped directly from INCEP, initial iPA units are projected for delivery at the end of Q3 2001. Volume shipments from INCEP are expected in 2002, with McKinley general availability.

iPA is scheduled to debut at the Intel Developer Forum Conference, Fall 2001 August 27-30 in San Jose, CA. As part of the introduction, INCEP will be displaying iPA in the Itanium-based Technology Demo Showcase. In addition, Ted DiBene II, INCEP’s chief technology officer, will be disclosing details on iPA during his presentation: “Solutions for High Density System Packaging of the Next Generation Itanium Processor”.

Jim Kaskade

Jim Kaskade is a serial entrepreneur & enterprise software executive of over 35 years. He recently successfully exited a PE-backed SaaS company, Janrain, in the digital identity security space. He started his career engineering massively parallel processing datacenter applications. Prior to identity, he led a digital application business of over 7,000 people ($1B). Prior to that he led a big data & analytics business of over 1,000 ($250M). He was the CEO of a Big Data Cloud company ($50M); was an EIR at PARC (the Bell Labs of Silicon Valley) which resulted in a spinout of an AML AI company; led two separate private cloud software startups; founded of one of the most advanced digital video SaaS companies delivering online and wireless solutions to over 10,000 enterprises; and was involved with three semiconductor startups (two of which he founded, one of which he sold). Jim has an Electrical and Computer Science Engineering degree from University of California, Santa Barbara, with an emphasis in semiconductor design and computer science; and an MBA from the University of San Diego with an emphasis in entrepreneurship and finance.

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