INCEP™ Delivers New IA64 Processor Packaging for Intel-based, High-Density Concept Server

INCEP Technologies announced today delivery of core packaging technologies for a high-density concept server scheduled for display at the Intel Developer Forum. As part of a new prototype development agreement, INCEP has collaborated with Intel to design a small form-factor IA64 concept server, designed for Intel’s Itanium™ processor family. The concept server will use INCEP’s power and thermal technologies as part of an integrated approach to processor packaging. This follows INCEP’s design of features for an initial IA64 small form-factor server with Intel in 2H 2000.

“INCEP enables the power of silicon by combining power, thermal, and EMI solutions within an integrated architecture that meets our customers’ needs for increased performance, functionality, and cost effectiveness in compact electronic packages,” stated Jim Hjerpe Kaskade, President of INCEP Technologies. “Only by taking a system-level view to chip-level packaging is INCEP able to provide a solution which offers a roadmap for several CPU generations.”

“Intel continues to work with the industry to enable high-performance, high-density computing with our Itanium™ processor family,” said Tomm Aldridge, Director of Intel’s Advanced Systems Lab. “Intel continues to work with companies that provide advanced technologies, such as INCEP’s processor packaging technologies for the Itanium processor.”

Jim Kaskade

Jim Kaskade is a serial entrepreneur & enterprise software executive of over 35 years. He recently successfully exited a PE-backed SaaS company, Janrain, in the digital identity security space. He started his career engineering massively parallel processing datacenter applications. Prior to identity, he led a digital application business of over 7,000 people ($1B). Prior to that he led a big data & analytics business of over 1,000 ($250M). He was the CEO of a Big Data Cloud company ($50M); was an EIR at PARC (the Bell Labs of Silicon Valley) which resulted in a spinout of an AML AI company; led two separate private cloud software startups; founded of one of the most advanced digital video SaaS companies delivering online and wireless solutions to over 10,000 enterprises; and was involved with three semiconductor startups (two of which he founded, one of which he sold). Jim has an Electrical and Computer Science Engineering degree from University of California, Santa Barbara, with an emphasis in semiconductor design and computer science; and an MBA from the University of San Diego with an emphasis in entrepreneurship and finance.

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