iPA integrates power, thermal & mechanical solutions into a single µP module
Author: Jim Kaskade
Jim Kaskade is a serial entrepreneur & enterprise software executive of over 38 years. He was the CEO of Conversica, PE-backed leader in AI Automation solutions that help clients grow revenue. He successfully exited PE-backed SaaS company, Janrain, in the digital identity security space. Prior to identity, he led a digital application business of over 7,000 people ($1B). Prior to that he led a big data & analytics business of over 1,000 ($250M). He was the CEO of a Big Data Cloud company ($50M); was an EIR at PARC (the Bell Labs of Silicon Valley) which resulted in a spinout of AML AI company, Quantiply; led two separate private cloud software startups; founded of one of the most advanced digital video SaaS companies delivering online and wireless solutions to over 10,000 enterprises; and was involved with three semiconductor startups (two of which he founded, one of which he sold). He started his career engineering massively parallel processing datacenter applications. Jim holds an Electrical and Computer Science Engineering degree from University of California, Santa Barbara, with an emphasis in semiconductor design and computer science; and an MBA from the University of San Diego with an emphasis in entrepreneurship and finance.
INCEP focuses on power, thermal, and EMI for high-performance microprocessors
INCEP will present “System Interconnection & Power Delivery” during the session “Concept Technologies for High
INCEP Technologies promotes Jim Hjerpe Kaskade to President
PowerDirect™ provides a new distribution architecture with an advanced power interconnect
INCEP focuses on thermal, power, and EMI for high-performance microprocessors.
Computer industry pioneers Jack E. Shemer, Arthur J. Collmeyer, and Robert V. Adams have been
INCEP focuses on addressing thermal, power, and EMI issues for high-performance microprocessors