iPA integrates power, thermal & mechanical solutions into a single µP module
INCEP Technologies today introduced iPA for high density servers based on the next-generation Intel® Itanium™ processor (code name McKinley). iPA is a single integrated proprietary power, thermal and mechanical module for server OEMs to integrate with McKinley. iPA is estimated to create volume savings of up to 40%, improve power margins by 50%, and provide over 40% gains in thermal efficiency. In addition, iPA will enable OEMs to package processors for 1U-2 way, 3U-4 way, 5U-8 way and emerging “Blade” servers. Shipped directly from INCEP, initial iPA units are projected for delivery at the end of Q3 2001. Volume shipments from INCEP are expected in 2002, with McKinley general availability.
iPA is scheduled to debut at the Intel Developer Forum Conference, Fall 2001 August 27-30 in San Jose, CA. As part of the introduction, INCEP will be displaying iPA in the Itanium-based Technology Demo Showcase. In addition, Ted DiBene II, INCEP’s chief technology officer, will be disclosing details on iPA during his presentation: “Solutions for High Density System Packaging of the Next Generation Itanium Processor”.