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INCEP™ Delivers New IA64 Processor Packaging for Intel-based, High-Density Concept Server

INCEP Technologies announced today delivery of core packaging technologies for a high-density concept server scheduled for display at the Intel Developer Forum. As part of a new prototype development agreement, INCEP has collaborated with Intel to design a small form-factor IA64 concept server, designed for Intel’s Itanium™ processor family. The concept server will use INCEP’s power and thermal technologies as part of an integrated approach to processor packaging. This follows INCEP’s design of features for an initial IA64 small form-factor server with Intel in 2H 2000.

“INCEP enables the power of silicon by combining power, thermal, and EMI solutions within an integrated architecture that meets our customers’ needs for increased performance, functionality, and cost effectiveness in compact electronic packages,” stated Jim Hjerpe Kaskade, President of INCEP Technologies. “Only by taking a system-level view to chip-level packaging is INCEP able to provide a solution which offers a roadmap for several CPU generations.”

“Intel continues to work with the industry to enable high-performance, high-density computing with our Itanium™ processor family,” said Tomm Aldridge, Director of Intel’s Advanced Systems Lab. “Intel continues to work with companies that provide advanced technologies, such as INCEP’s processor packaging technologies for the Itanium processor.”

Posted in Semiconductors.


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