Skip to content


INCEP™ to present at Intel Developer Forum

INCEP will present “System Interconnection & Power Delivery” during the session “Concept Technologies for High Density Intel® Itanium™ Processor Family Servers”

INCEP Technologies announced today Ted DiBene’s participation at the Intel Developer Forum (IDF) being held February 26 – March 1 at the San Jose Convention Center. Mr. DiBene will be presenting “System Interconnection & Power Delivery” during the session Concept Technologies for High Density Intel® Itanium™ Processor Family Servers which is part of the Enterprise Platform Ingredients and Technology track.

INCEP’s initial successful completion of concept Intel® Itanium™ Processor Family dense server efforts with Intel in 2H 2000 led to an additional collaboration whereby INCEP and Intel engineering teams are currently developing additional designs for thin form-factor concept servers based for future Itanium™-based servers potentially starting with the McKinley processor. This new design would leverage INCEP’s power and thermal technologies in an integrated approach to processor packaging. As a result of INCEP’s work with Intel, Mr. DiBene was asked to present during IDF.

Posted in Semiconductors.


0 Responses

Stay in touch with the conversation, subscribe to the RSS feed for comments on this post.

You must be logged in to post a comment.