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INCEP™ Exhibits Integrated Power, Thermal & Mechanical Solutions for Microprocessors at IDF

iPA™ Units for McKinley will be on site at INCEP Technologies booth #806 during the Intel Developer Forum, Moscone Center,
San Francisco February 25-27

INCEP Technologies will display their patented iPA™ solution for integrating power, thermal & mechanical elements in a single module for the 64 bit McKinley microprocessor. Production-ready models will be located at INCEP’s booth # 806 in the IDF Technology Showcase. Key INCEP staff will be available for product presentations, product application, and discussions regarding future processor packaging.

iPA is a single integrated module that provides power, thermal and packaging for the McKinley processor. With the iPA Server OEMs are expected to enjoy chassis volume savings of up to 40%, improved voltage margins by 50%, and a 40% gain in thermal efficiency. iPA supports the OEM’s broad needs to package McKinley processors in 1U-2 way, 3U-4 way, 5U-8 way and emerging “Blade” servers. Available from INCEP’s supply partners, volume shipments are expected in 2H 2002, in line with McKinley expected general availability.

The iPA is just the first of the PrISM™ family of products – a complete Processor Integrated Support Module delivering power, thermal, and packaging for microprocessor. At IDF INCEP will selectively preview the next step in the PrISM family, the m-iPAKTM. The m-iPAK is architected to meet the major challenges presented by next generation, high performance microprocessors along with the potential for 50% savings in overall space volume and a 10X improvement in power delivery performance.

Posted in Semiconductors.

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